Nexstrom’s $12M Bet Targets 2D Materials on Wafers
The Singapore startup is building a wafer-scale production tool for 2D materials, but foundry qualification remains ahead.
Business, technology and what comes next.
NextNow / Archive
The Singapore startup is building a wafer-scale production tool for 2D materials, but foundry qualification remains ahead.
The new Atlas 960E SuperPoD shifts the contest with Nvidia from individual chips to tightly integrated systems spanning compute, interconnect, memory and software.
AMD’s Helios rack-scale design combines 72 MI455X accelerators with EPYC processors and Pensando networking as it challenges Nvidia’s AI infrastructure lead.
A new Sony-controlled venture will combine sensor design and advanced manufacturing to produce smartphone image sensors from 2029.
Reuters reported that the memory-chip makers have tested AMEC equipment as a possible contingency for their factories in China; Samsung disputed the report.
Record semiconductor profits and a proposed $100 billion Kentucky data-center complex show how AI investment is expanding beyond models and software.
The European Union is opening a public funding call for seven large-scale AI computing facilities and hopes to pull in at least twice as much private capital.
Intel and Google Cloud are moving Gemini into engineering, chip development, supply-chain and corporate workflows—a more revealing deployment model than a companywide chatbot license.
SambaNova’s $1 billion Series F first close values the inference company at $11 billion and shows how much capital is still chasing alternatives to the dominant GPU stack.
The interconnect startup’s $50 million strategic financing from major chip and cloud companies highlights a constraint that faster processors cannot solve alone: moving data across an AI system.